Possibility of Using Crude and Expanded Vermiculite in Cement-Bonded Particleboard Production

The aim of this study is to investigate the effect of using vermiculite on the thermal, physical and mechanical properties of cement-bonded particleboards. For this purpose, single-layer cementitious particle boards with a final density of 1200 kg/m3 and a size of 550 x 550 x 10 mm were produced using 2 type vermiculites (crude and expanded) at three different ratios (5%, 10% and 15%). The produced boards were examined in terms of thermal (TGA/DTG), physical (moisture content, density, water absorption and thickness swelling), mechanical (modulus of rupture, modulus of elasticity, internal bond strength and screw withdrawal resistance) properties. According to the TGA results, using both types of vermiculite caused an increase in cement hydration products in the boards and increased the thermal resistance. While the use of vermiculite did not significant effect on the density and moisture content of the boards, it increased the dimensional stability of the boards. The values of modulus of rupture and modulus of elasticity increased when the low amount of vermiculite was added. However, with the use of vermiculite in the boards, there was a decrease in the internal bond strength and screw withdrawal resistance values in general. All boards produced using vermiculite met the values specified in EN standards.

Influence of pumice powder on some properties of phenol-formaldehyde bonded particleboards

In this study, pumice powder as a volcanic aggregate was added in the particleboards’ production. The effect of various ratios of pumice powder (10%, 20%, 30%, and 40%) on physical, mechanical, thermal and fire resistance properties was investigated. Pumice powder did not significantly affect particleboards’ water absorption and thickness swelling values. However, the mechanical properties were significantly affected with raising pumice powder content. The modulus of rupture and modulus of elasticity decreased up to 46% and 45%, respectively. There was also a decrease in the internal bond strength up to 42%. Conversely, pumice powder improved the thermal degradation temperatures. The onset temperatures increased with increasing pumice powder content above 300°C. Similarly, the pumice powder improved the fire resistance of particleboards up to 7% compared to control samples.