Short notes. COMPARATIVE STUDY OF THE IMPACT OF THERMAL MODIFICATION PARAMETERS ON THE THERMAL CONDUCTIVITY OF DIFFERENTWOOD COMPOSITE PANELS
This study examined how thermal modification influenced the thermal conductivity of plywood, oriented strand board, and medium-density fiberboard. Samples were exposed to two temperature levels, 130°C and 180°C, for 20 and 40 min, while untreated panels were retained as controls. Measurements were carried out under controlled laboratory conditions using the steady-state hot-box method. The thermal modification consistently reduced thermal conductivity across all materials, which suggests improved insulation properties. The observed reductions varied. OSB exhibited the most significant overall decrease in thermal conductivity, while plywood displayed relative stability; conversely, MDF demonstrated a marked reaction under the more rigorous treatment conditions. The type of material used had the most significant overall statistical effect. The duration of the treatment was more important than the temperature. The interaction between temperature and time did not achieve statistical significance within the parameters of the experiment; conversely, interactions involving material type were significant.