Technology of Particleboard’s Preparation by Cold Pressing after Hot Mat Compression
The article describes a method of preparing particleboards (PB) from fresh and recycled chips by a new technology of cold pressing after hot compression of the mat according to PCT/SK2023/000007 (ÚPV SR, 13.06.2023) using polyvinyl acetate (PVAc) glue. For comparison, the experiment was also carried out using urea formaldehyde (UF) glue and their mutual combination. The new method shortens hot pressing, or causes reduction of pressing temperatures, while the prepared PB released from pressure no longer spring and cure over time. The curing kinetics of both PVAc and UF adhesives were described by monitoring the flexural strength and modulus of elasticity of PB as a function of time after release of pressure.
Modeling of the PB pressing process based on PVAc glue, which consists of overheating the pressed cross-section of the board to 90°C and its subsequent cooling to a temperature when the board is already stable, i.e. below a temperature of 70°C, was carried out using of a hot and cold press, while the pressing cycle lasted 140 s. Shortening the pressing cycle to 100 s was achieved by applying the glue to the chips already preheated to 92°C. Laboratory tests have confirmed that the mechanical properties of PB are in accordance with the requirements of EN 312/3 for chipboards for interior conditions, including furniture, for use in dry environments.